30, according to foreign media reports, according to media exposure of the Microsoft Windows Phone platform roadmap shows that introduction of Windows Phone 8 “Apollo” system, Microsoft will pay more attention to the hardware. While Microsoft next year will be the first release Windows Phone “Tango” system, but the hardware powerful “super phone” will be Microsoft’s next year’s focus.

Previously, Windows Phone platform that is acclaimed, the platform does not require the latest and best hardware to provide users with a unified flow experience.IC Samsung Focus Flash for example, this phone is on AT & T contract price is low, but other Windows Phone mobile phone market as well. This means that, Windows Phone platform in a variety of different prices available on the phone almost the same experience.

But cell phone manufacturers will face a difficult problem, namely, how to make Windows Phone handset differentiation, highlighting the selling points of their own cell phone. Mobile phone manufacturers can decide whether to adopt the large-screen or physical keyboard. However, the Microsoft Windows Phone Apollo platform of “super phone” in the pursuit of means that Microsoft will likely take a similar approach the Android platform.

That it do so would be “fall into the trap”, but this approach is understandable. Samsung Electronics and Motorola mobile and other companies can choose what operating system, and developed products to market that they can think of any. At the same time, technology blog, and evaluation of personnel for the new product is very concerned about the hardware parameters, which allows users began to pursue the processor frequency and the camera pixels. The end result of this trend is to give users a lot of choice, and performance of the best products will get the most attention.

This is not to say that the phone’s hardware is not important. In fact, if you want to provide users with excellent experience, the hardware is critical. However, a careful analysis of the processor frequency can be found in the paper even slightly higher, but the actual performance gains may be small.

Windows Phone platform currently has some shortcomings, but these defects are unlikely to resolve through the new hardware. The problem is that Windows Phone operating system itself, and even the first generation of hardware can be a good support system, so blindly to enhance the hardware and will not bring much different.

It is not clear that Microsoft is “super phone” to develop the hardware parameters. Dual-core processor, and support for LTE network will be welcome, be sure that the hardware configuration will soon appear on the Windows Phone handset. However, such hardware upgrades just to keep pace with competitors, Windows Phone Apollo is also not clear what will make significant improvements.

According to previous rumors, “Apollo” is a Windows Phone 8 of the Code, and the version of the system will be the fourth quarter of next year. Before this time, Windows Phone platform there is a big variable. If some important changes, then the “super phone” relative to the current hardware will be able to provide a better Windows Phone 8 experience.

If the road map information is accurate, then the expected Microsoft’s first “super phone” will be available in the fourth quarter of 2012. However, due to the rapid updating of the Android platform and Apple’s year-end sales, Microsoft’s products will face a serious disadvantage. Therefore, from now until the fourth quarter of next year, regardless of Microsoft’s development progress, Microsoft will face stiff competition.

30 news, according to Japanese tech blog Macotakara reported suspected iPad 3 components of the base connector early exposure, Apple’s next-generation tablet PCs will continue to use 30-pin dock connector, which negates the previous iPad 3 for connection with a small the mouth of the rumors.

Macotakara claimed to be the prototype for the iPad 3 components manufactured by a small amount, they are referred to as “replacement parts” including a microphone with a flexible cable, a power on / off soft cable and a dock connector charging interface. Texas Instruments

One connector is the three baseband components of the most important, because the existing Apple iPhone, iPad and iPod models are using this interface. Exposure of the picture shows, the new connector port relatively shallow, less than before the connector.

Macotakara in October of this year reported that the next generation of Apple’s iPad will use the new, smaller base connector, while still using the 30-pin circuit configuration, but it has been redesigned, smaller form factor.

Currently used 30-pin dock connector for the first time in April 2003, Apple introduced the iPod, and has not changed a long time, Apple will even touch it for a smaller screen iPod nano.

In addition, power on / off cable containing the power button, rotate the lock button and volume keys, which indicates that the hardware configuration will appear on the iPad 3. The microphone cable is soft with iPad 2 components in the original on the basis of a re-design.

Exposure of internal components as the new circuit arrangement and differ iPad 2, so there is speculation that the iPad 3′s internal components may be substantially redesigned.

The first suspected iPad 3 components exposed in July, Apple also suggests that the component will be designed next-generation tablet PC would have a major change. At least on the inside may be re-design, because the number of hardware components has changed.

Spiritual core integrated, SmartChip Integration-SCI) announced that its Wi-Fi baseband (Baseband) processor technology has been the global leader in IP communications adoption and integration approach to integrate with the appropriate technology platform. Spiritual core integrated with proprietary Wi-Fi technology to collaborate with the company, its product line offers comprehensive Wi-Fi wireless transmission solutions, product upgrades and help the company reduce costs and enhance market competitiveness. This partnership marks the spiritual core integrated Wi-Fi baseband IP licensing technology cooperation model formally recognized and accepted by the market, the spiritual core integrated into the only company able to provide Wi-Fi baseband processor and the ability to support IP provide radio frequency (RF) chip design solutions. Thus, in the spirit of the core integrated Wi-Fi wireless communications market, he also completed a major layout, as currently only provides both Wi-Fi chip sales, marketing modules and IP licensing business model three kinds of design.
At the same time, also announced its spiritual core integrated Wi-Fi baseband chip has successfully passed the S901 family in China Computer Industry Association, the wireless access network and network security technology WAPI Industry Alliance Committee of the product certification testing, and this month formally joined the WAPI Industry Alliance, a member of the alliance, which marks the spiritual core integrated Wi-Fi chip solution for wireless LAN security support Chinese mandatory standards – WAPI standard, which is the spiritual core of China’s integration following the October The first company to receive international Wi-Fi Alliance certification and were allowed to use the Wi-Fi Logo design is another major piece of good news after the company, so that spiritual core integrated Wi-Fi chips in China, the market plays an important role to play.

Spiritual core integrated with Wi-Fi baseband processor technology and RF technology, the performance indicators are in line with IEEE802.11 standards, the power consumption and chip area have an advantage, Wi-Fi baseband (Baseband) Processor Support for USB a variety of forms and SDIO interfaces, and supports WAPI encryption standard. The overall spirit of the core integrated Wi-Fi chip solution is being more and more attention to domestic and foreign manufacturers, is bound to smart phones, tablet PCs, cloud computing and physical networking applications provide a cost-effective alternative. Spiritual core integrated Wi-Fi chips are very flexible business model, including chips and modules to provide sales and IP licensing and other modes of cooperation. Meanwhile, Spirit also offers core integrated GPS baseband and RF chips, Beidou navigation chip, DVB-S2/ABS-S / CMMB RF tuner chip, 2.4GHz RF transceiver chip, and ETC solutions.

For the world’s most popular consumer electronics manufacturers of CMOS imaging solutions, today announced a leading provider of Aptina AS0260 SOC (system on chip) imaging solutions. The 2-megapixel original 1080p SOC offers excellent performance and can meet the video-centric consumer electronics market in ultra-thin full-HD video applications, strict size requirements (z-height less than 3.5mm). New optical format for SOC 1 / 6 inches and has a new 1.4-micron pixel, using Aptina ™ A-Pix ™ technology to provide excellent low-light performance. 1080p/30fps or 720p/60fps new SOC provides high-definition video, and its powerful image processing capabilities for realistic and clear video capture is critical.
AS0260 provides the SOC-specific features, including three-dimensional or 3D camera for the integration of multi-camera synchronization, off-axis camera settings for perspective correction, adaptive polynomial lens shading correction, for the USB / ISP interface to bridge device UVC support, and automatic image correction and enhancement. In addition, AS0260 also the original equipment manufacturer (OEM) market today is better than many other offers full HD (or 1080p) solution benefits, and MJPEG formats of data output can support bandwidth-compressed video stream; presence detection for system power-saving features and the ambient light sensor, as well as for identification and security applications in face detection and tracking performance.

Aptina’s mobile, PC and games vice president and general manager Farshid Sabet, said: “AS0260 is our growing portfolio of high-definition video solutions, a rare new member of this SOC has an excellent performance, rapid adoption of and cross-platform video conferencing applications for a variety of innovative and advanced features to easily meet the needs of the OEM market. “

(WSTS) has cut its 2012 global chip market growth rate predicted from the original 7.6%, 2.6% update; But the organization’s 2013 chip market growth forecast upgrade from the original 5.4% 5.8 percent.
WSTS now predicts that the global semiconductor market revenue in 2011 will be 3,020 billion U.S. dollars, the growth rate of 1.3%, similar to other projections (EETimes U.S. estimated 2011 global chip market growth rate of between 0 to 2%); 2012 global semiconductor market revenue is estimated at $ 30.1 billion, growing 2.6% over the previous year, the market growth rate in 2013 is estimated at 5.8%, revenue size of 3,280 billion U.S. dollars.

“In 2011, the semiconductor industry must resist the global economic slowdown; causes of this financial crisis, including the European debt crisis, industrial and consumer confidence was declining as a result of the earthquake in Japan caused by floods and Thailand supply chain disruptions . “WSTS added that excess supply in 2011 DRAM makes memory market revenue decline, which partly offset by a microcontroller, sensors and other discrete components market” healthy growth. “

IC Electronic Components | Texas Instruments

 ( microchip) today announced a new 8-bit PIC MCU PIC10F (LF) 32X and PIC1XF (LF) 150X. The MCU uses 6 to 20-pin package, integrates a configurable logic and advanced peripherals, including configurable logic unit (CLC), complementary waveform generator (CWG) and numerically controlled oscillator (NCO), can be achieved after low-lead pin count MCU functionality can not be achieved. Microchip’s Security, Microcontroller and Technology Development Division Business Development Manager Asia Pacific, Xu Jin believes that designers can use to enhance the products of these general MCU functions, design size, and reduce product cost and power consumption. Areas covered include household appliances (kitchen appliances), automotive (interior lighting), consumer electronics products (power tools) and industrial market (utility instruments) and so on.

In 2010, the world’s 8-bit, 16-bit, 32-bit MCU market share of 42%, 26% and 32%. Therefore, in the microcontroller market, still account for a large 8-bit MCU market share, target applications include automotive, medical, industrial and other fields. Xu Jin said, lower-power, highly integrated, high intelligent control, new features, and optimized according to application requirements will be the next 8-bit MCU, the overall trend. The 8-bit MCU to add CLC, CWG and other new feature is the Microchip along the trend should be made a new attempt, I believe will further expand the use of 8-bit MCU, but not limited to a particular area.

PIC10F (LF) 32X and PIC1XF (LF) 150X MCU’s peripherals can be achieved CLC combinational logic and sequential logic of the software control, increased peripheral and I / O on-chip interconnect, thereby reducing external components, saving code space and increasing function; CWG peripherals with multiple peripherals with the work generated with dead-time control and automatic shutdown of the complementary waveform to improve the switching efficiency; NCO peripheral linear frequency control and help to achieve high resolution, which the lighting ballasts, resonant tone generation and other applications such as control circuits required. Texas Instruments The new MCU also has low power operating mode current of less than 30μA/MHz, sleep mode is less than 20nA; and on-chip 16 MHz internal oscillator, ADC, and up to four pulse-width modulation peripheral. The temperature indicator module can be integrated to achieve low-cost temperature measurement.

Xu Jin said that in general needs to have a level of PWM signal output, such as motor control usually requires two different signals to control the complementary opposite. But the CWG process requires only one input, you can directly output two complementary signals. In addition, the general control signal can not control the dead, but dead-time control can be achieved CWG. Moreover, the motor or the power is sometimes necessary to quickly shut down or turn off the output signal, CWG has also joined the auto-off and automatic control.

To facilitate application development, Microchip PICDEM also provided with sample experimental development kit. In addition, F1 Evaluation Platform will help with enhanced mid-range 8-bit PIC microcontroller core (including PIC1XF (LF) 150X series) for development. CLC also offers a free configuration tool that allows the simulation graphical user interface registers and combinational logic functions, to simplify the process of CLC module settings.

Microchip’s standard development tools support all of these new MCU, including the PICkit 3 debugger / programmer, MPLAB IDE, MPLAB REAL ICE emulator and the MPLAB ICD 3 in the debugger and the MPLAB and HI-TECH C compiler. All of these tools are now available from the microchipDIRECT order.

Committed to building value-added connectivity of ecosystems leading semiconductor manufacturer SMSC (NASDAQ: SMSC) today announced the industry’s first fully integrated high-speed inter-chip (HSIC) USB 2.0 to 10/100 Ethernet devices LAN9730. It is designed for a variety of embedded systems and consumer electronics equipment OEM and ODM designers to help them save power consumption and cost of materials (BOM).

Using patented chip connection between the SMSC (Inter-Chip Connectivity ™, ICC) technology, HSIC, make billions of today has been widely used in electronic devices USB 2.0 protocol for short transmission distances, while simulation-based USB 2.0 100% compatible with the connection software. Following NVIDIA, Qualcomm and other companies, the Advanced Micro Devices (AMD) and Samsung recently joined the ICC technology licensing from the SMSC to obtain the ranks, from portable systems to achieve a single chip (SoC) to USB 2.0 peripherals for communication between the HSIC.maxim ic HSIC has been included as part of the USB 2.0 standard, can significantly reduce the need for Ethernet port of the battery-powered portable equipment power consumption. LAN9730 integrated 10/100 physical layer built-in power management and a number of enhancements, including Magic Packet and Link Status Change, and the “LAN Wake” (Wake on LAN) mode that allows the system enters a low power state, and in particular network information appears a wake-up during standby can save resources.

SMSC Vice President and General Manager, Network Solutions, said Rolf Mahler: “Design of performance and flexibility, and low-power network solutions SMSC products are an important design element of line. For embedded and consumer applications, this devices of the ICC can play our patented technology, and compared to standard analog USB 2.0 interface, can significantly reduce power consumption and chip area. ”

The new SMSC LAN9730 is increasingly expanding USB-to-Ethernet solutions product family members, it is consistent with USB 1.1 and 2.0 specification, and IEEE 802.3/802.3u Ethernet standards. In addition, LAN9730 only a 25MHz crystal, can also drive USB and Ethernet physical layer (PHY), so developers can reduce BOM costs.

SMSC’s integrated, USB-based network solutions for the system in any one network connection to provide more flexibility in placement and routing. In addition, LAN9730 supports Windows ®, Mac ® and Linux ® operating system such as a variety of the latest version of the driver. LAN9730 Ethernet connection those who need a battery-powered portable devices the ideal choice. LAN9730 uses 8x8mm, 56-pin small-size lead-free QFN package, RoHS compliant, and business rules (0 ° C to 70 ° C) and industrial specifications (-40 ° C to 85 ° C) Both the temperature range. Verification samples and evaluation kits are available now, is expected to begin volume production in January 2012.

Committed to building value-added connectivity of ecosystems leading semiconductor manufacturer SMSC (NASDAQ: SMSC) today announced the industry’s first fully integrated high-speed inter-chip (HSIC) USB 2.0 to 10/100 Ethernet devices LAN9730. It is designed for a variety of embedded systems and consumer electronics equipment OEM and ODM designers to help them save power consumption and cost of materials (BOM).

Using patented chip connection between the SMSC (Inter-Chip Connectivity ™, ICC) technology, HSIC, make billions of today has been widely used in electronic devices USB 2.0 protocol for short transmission distances, while simulation-based USB 2.0 100% compatible with the connection software. Following NVIDIA, Qualcomm and other companies, the Advanced Micro Devices (AMD) and Samsung recently joined the ICC technology licensing from the SMSC to obtain the ranks, from portable systems to achieve a single chip (SoC) to USB 2.0 peripherals for communication between the HSIC. HSIC has been included as part of the USB 2.0 standard, can significantly reduce the need for Ethernet port of the battery-powered portable equipment power consumption. LAN9730 integrated 10/100 physical layer built-in power management and a number of enhancements, including Magic Packet and Link Status Change, and the “LAN Wake” (Wake on LAN) mode that allows the system enters a low power state, and in particular network information appears a wake-up during standby can save resources.

SMSC Vice President and General Manager, Network Solutions, said Rolf Mahler: “Design of performance and flexibility, and low-power network solutions SMSC products are an important design element of line. For embedded and consumer applications, this devices of the ICC can play our patented technology, and compared to standard analog USB 2.0 interface, can significantly reduce power consumption and chip area. ”

The new SMSC LAN9730 is increasingly expanding USB-to-Ethernet solutions product family members, it is consistent with USB 1.1 and 2.0 specification, and IEEE 802.3/802.3u Ethernet standards. In addition, LAN9730 only a 25MHz crystal, can also drive USB and Ethernet physical layer (PHY), so developers can reduce BOM costs.

SMSC’s integrated, USB-based network solutions for the system in any one network connection to provide more flexibility in placement and routing. In addition, LAN9730 supports Windows ®, Mac ® and Linux ® operating system such as a variety of the latest version of the driver. LAN9730 Ethernet connection those who need a battery-powered portable devices the ideal choice. LAN9730 uses 8x8mm, 56-pin small-size lead-free QFN package, RoHS compliant, and business rules (0 ° C to 70 ° C) and industrial specifications (-40 ° C to 85 ° C) Both the temperature range. Verification samples and evaluation kits are available now, is expected to begin volume production in January 2012.

Across multiple electronic applications, the world’s leading semiconductor suppliers and major personal computer original equipment manufacturer’s Trusted Platform Module (TPM) provider STMicroelectronics announced the industry’s highest performance trusted platform module, so that e-commerce and cloud computing services to achieve greater security and credibility of performance.
Ecosystem as a trusted computer components, Trusted Platform Module is installed on the computer motherboard high security processor, the computer software used to strengthen the attack or incident of theft or tampering with security threats such as defense capability. Trusted Platform Module to protect sensitive data, such as keys, passwords and digital certificates, provide credible reporting system data integrity. According to credible technology industry alliance to promote “The Trusted Computing Group” (TCG) data show that almost all business PCs, servers and embedded systems are currently built-in Trusted Platform Module.

STMicroelectronics ST33TPM12LPC the industry’s first microprocessor-based 32-bit security Trusted Platform Module, the performance over existing independent Trusted Platform Module, which can be hardware-based encryption technology to improve the safety level. The new Trusted Platform Module can handle advanced encryption algorithms, to support the next generation TPM 2.0 standard. ST33TPM12LPC through the functionality of certification and Common Criteria Evaluation Assurance Level 4 Enhanced-level security certification (EAL4). Since EAL4 standard based on the latest Protection Profile standard TPM 1.2, a new security processor fully compliant with the Trusted Computing Group’s TPM certification standards.

STMicroelectronics will launch with several different interfaces ST33TPM12LPC, such as built-in I2C and SPI interfaces Trusted Platform Module, the trusted hardware, applications to the desktop and notebook computers, servers and network equipment other than equipment such as printers, copiers, mobile phones, tablet PCs, home gateways, home appliances, smart meters, industrial controllers and automotive electronic systems.

ST33TPM12LPC proved once again that the release of STMicroelectronics in advanced processes and proprietary security technology, highest in the world level. STMicroelectronics security, general manager, Microcontroller Division, Marie-France Florentin, said: “STMicroelectronics not only for the personal computer market but also for the numerous networking platform brings performance and compatibility of the most trusted platform module, Italy STMicroelectronics products has been successful to support the Trusted Computer Group technology and new products to consolidate our leading position and know-how and assets play ability. ”

NIST (U.S. National Institute of Standards and Technology) to promote SHA-256 (Security Hash Algorithm version 2, 256-bit) algorithms for optimal use. Today, however, the utilization of the commercial market is still far lower than expected. STMicroelectronics delegate authority GlobalSign digital certificate issued by the new Trusted Platform Module Ltd. endorsement key (EK) certificate. GlobalSign Steve Roylance, Director of Business Development, said: “The root certificate in the TPM using this algorithm can determine the future of trustworthy computing environment to support long-term needs, to meet the NIST requirements and accelerate the replacement of aging equipment in the SHA1 can bring to today’s users real value. GlobalSign Root Certificate Center’s TPM is a series of 2048 of the RSA SHA-256 certificate. In order to promote the use of NIST information technology industry, the recommended standard web browser and operating system developers have a root certificate using other . ”

ST33TPM12LPC main features:

· ARM SC300 32-bit secure processor supports the following functions:

· SHA1 and SHA2 Hash Algorithm

· AES

Support for next generation TPM 2.0 specification

Built by an independent third-party certification center (GlobalSign) root certificates issued by EK

· Built-in 90nm non-volatile memory

· Streamline the pin (LPC) interface

IC Component  |  maxim ic